OSH Park
Profile for siahman
Shared projects
Ekho Mobile 2L Rev. B
by
siahman.
2
layer board of
0.86x1.43
inches
(21.92x36.32
mm).
Shared on
August 20th, 2015 02:40.
Two layer version, new revision.
CC1101 Rev. B
by
siahman.
2
layer board of
1.07x0.55
inches
(27.05x14.07
mm).
Shared on
August 20th, 2015 02:36.
Tuned to 433MHz, very small, RF transceiver using TI’s standard CC1101 module, and a chip antenna. Parts needed are listed in the schematic.
Ekho FEB v2.0
by
siahman.
4
layer board of
3.85x2.99
inches
(97.79x75.87
mm).
Shared on
November 12th, 2014 17:59.
Ekho: Realistic and Repeatable Experimentation for Tiny Energy-Harvesting Sensors
Josiah Hester, Timothy Scott, Jacob Sorber
School of Computing, Clemson University
Our paper, “Ekho: Realistic and Repeatable Experimentation for Tiny Energy-Harvesting Sensors” describes the design and evaluation of a new tool for recording and replaying energy harvesting conditions. Energy harvesting is a necessity for many small, embedded sensing devices, that must operate maintenance-free for long periods of time. However, understanding how the environment changes and it’s effects on device behavior has always been a source of frustration. Ekho allows system designers working with ultra low power devices, to realistically predict how new hardware and software configurations will perform before deployment. By taking advantage of electrical characteristics all energy sources share, Ekho is able to emulate many different energy sources (e.g., Solar, RF, Thermal, and Vibrational) and takes much of the guesswork out of experimentation with tiny, energy harvesting sensing systems.
This paper received the BEST PAPER Award at the 12th ACM Conference on Embedded Networked Sensor Systems (SenSys 2014), held in Memphis, Tennessee November 3-6, 2014.
Analog-Front End PCB
This is the PCB for the analog front end. We are hosting it on OSH Park so anyone can print the board themselves.
More details on assembly, and usage can be found at josiahhester.com/ekho
Eagle files, gerbers, Bill of Materials, and Code can be found on Github.
AD7276 Breakout
by
siahman.
2
layer board of
0.63x0.39
inches
(16.03x9.80
mm).
Shared on
August 27th, 2014 20:29.
12-bit, 3MSPS ADC from Analog Devices. SPI at 50MHz.
LTC2314 Breakout
by
siahman.
2
layer board of
0.63x0.63
inches
(16.03x15.90
mm).
Shared on
August 27th, 2014 20:29.
14-bit, 4.5MSPS ADC with 87.5MHz SPI interface.