OSH Park
Shared projects
eRIC dongle v1.9
by rwinscot.
2
layer board of
0.83x1.64
inches
(21.11x41.61
mm).
Shared on
August 14th, 2014 11:57.
Dongle implementation for the eRIC Wireless SoC.
nRF24L01+TeensyAdapter.v01
by
2
layer board of
0.71x0.41
inches
(17.93x10.29
mm).
Shared on
August 14th, 2014 06:03.
Adapter board for nRF24L01+ 2.4 GHz rf radio to mount directly on top of Teensy 3.1
biopotential
by PaulStoffregen.
2
layer board of
1.45x1.85
inches
(36.88x47.07
mm).
Shared on
August 13th, 2014 21:45.
Filastruder Filawinder Electronics
by mmorning.
2
layer board of
1.72x2.80
inches
(43.76x71.12
mm).
Shared on
August 13th, 2014 18:33.
Winder to help spool the filament
Filastruder Filawinder Sensor PCB
by mmorning.
2
layer board of
0.69x2.40
inches
(17.48x60.96
mm).
Shared on
August 13th, 2014 18:33.
Sensor PCB for filament tension