Winbond Flash SOIC8 to DIP Dual REV:D.2

by DAProgs.
Top
Bottom

2 layer board of 0.38x0.38 inches (9.53x9.53 mm).
Shared on January 19th, 2015 20:39.

Winbond Flash SOIC-8 to DIP breakout
Dual line breakout for breadboards

Order board. Download. Permalink. Embed order link.

Copy this HTML into your page to embed a link to order this shared project