OSH Park
Shared projects
Input Power Board (TH) v1.1
by
Jenner.
2
layer board of
1.65x1.03
inches
(41.81x26.06
mm).
Shared on
August 30th, 2016 04:17.
Breadboard-compatible board breaks out 9V, 5V, and 3.3V from a 9V battery using only through-hole components.
This is a design to practice soldering through-hole parts.
Check out the Github repo for parts and assembly information.
This project is released under the Open Hardware License v1.2.
Universal GPS RF Front-end Board v2
by
Jenner.
4
layer board of
3.41x1.73
inches
(86.64x43.94
mm).
Shared on
August 30th, 2016 04:12.
This board uses the MAX2769 chip with an STM32F4 controller. It has been superseded by version 3, which you can check out here.
Stm32f4 Discovery Breakout V2
by
Jenner.
2
layer board of
2.30x2.95
inches
(58.47x74.98
mm).
Shared on
August 30th, 2016 04:09.
This project is released under the Open Hardware License v1.2.
3G Cellphone Module v1
by
Jenner.
4
layer board of
4.06x1.84
inches
(103.12x46.69
mm).
Shared on
August 30th, 2016 04:04.
This board extended David Mellis' DIY Cellphone to 3G. It was itself extended again by Kevin Lynagh and presented at !!Con.
The Github repo has more information.
This project is released under the MIT License.
Oven Control Board v3.1
by
Jenner.
2
layer board of
2.92x1.80
inches
(74.19x45.72
mm).
Shared on
August 30th, 2016 04:01.
Control board for composite curing oven at Portland State Mechanical Engineering Department.
More information at the Github repo.