![]() |
¾÷ü¸í | »ï¼ºÀü±â/Áß¾Ó¿¬±¸¼Ò |
¸ðÁýºÐ¾ß/¾÷¹« | RF |
°æ·Â À¯¹« | °æ·Â |
º´¿ªÆ¯·Ê | ºÒ°¡´É |
¸ðÁý±âÇÑ | ä¿ë½Ã±îÁö |
±Ù¹«Áö | ¼ö¿ø |
ȸ»ç ȨÆäÀÌÁö | http:// |
Á¢¼ö Email | hlake.park@samsung.com |
¹®ÀÇÀüȹøÈ£ ¹× ´ã´çÀÚ |
¹ÚÈ£¼ö/010-3297-1518 |
±âŸ»çÇ× | 1. ȸ»ç: »ï¼ºÀü±â/Áß¾Ó¿¬±¸¼Ò 2. ÀÀ½ÃÀÚ°Ý - RFÀü°øÀÚ·Î RF°ü·Ã¾÷°è Á¾»ç (Çлç ÈÄ 4³âÀÌ»ó / ¼®»çÈÄ 2³âÀÌ»ó) - Çʼö »ç¿ë Software: ADS, HFSS - ¿ì´ë: FBAR(Film Bulk Acoustic wave Resonator)°ü·Ã À¯ °æÇèÀÚ SAW(Surface Acoustic Wave resonator)°ü·Ã À¯ °æÇèÀÚ CAD »ç¿ë°¡´ÉÀÚ COMSOL »ç¿ë°¡´ÉÀÚ MEMS(Micro Electro-mechanical System) °øÁ¤°ü·Ã Áö½Äº¸À¯ Wafer level package, Package °ü·Ã Áö½Äº¸À¯ 3. Á¦Ãâ¼·ù: ÀÚ±â¼Ò°³¼ (Çü½ÄÀº ¾øÀ¸¸ç, Àü°ø ¹× Á÷¹«¿¡ °ü·ÃµÈ ³»¿ë¸¸ ¼Ò°³) 4. ±Ù¹«Á¶°Ç: »ï¼ºÀü±â Á¤±ÔÁ÷ 5. ÀüÇü¹æ¹ý: ÀÚ±â¼Ò°³¼¸¦ ¸ÞÀÏ(hlake.park@samsung.com)·Î Á¦Ãâ |
¸ñ·ÏÀ¸·Î | ¼öÁ¤Çϱâ/µî·ÏÀϰ»½Å½Åû ±¸ÀÎÁ¾·á-»èÁ¦Çϱâ |
Copyright by RF designhouse. All rights reserved. |