Job description
Amplifier Research Corporation, world leader in the design and manufacture of high-power broadband, RF amplifiers is seeking an experienced Wire Bonder and Die Attach Assembler. The successful candidate will perform manual and semi-automatic microelectronic/ semiconductor wire-bonding using wedge and ball bonding machines. Epoxy and eutectic die attach experience required. Minimum 2 years experience required.
Competitive salary & benefit package makes AR a great place to work! AR is located 5 minutes from Lansdale exit of the PA turnpike in Souderton, PA.
